Conference Program Chair Anand Raghunathan Purdue Univ. 465 Northwestern Avenue West Lafayette, IN 47907 765-494-3470 Email
Technical Program Chair Harry Foster Mentor, A Siemens Business. 840 Shenandoah Dr. Plano, TX 75023 972-979-8342 Email
AS1. Autonomous Systems (Automotive, Robotics, Drones)
Wanli Chang
University of York
Michael Glass
Ulm University
Wenchao Li
Boston University
Chung-Wei Lin
National Taiwan Univ.
Selma Saidi
Hamburg University of Technology
Sebastian Steinhorst
Technical University of Munich
Haibo Zeng
Virginia Polytechnic Institute and State University
Dirk Ziegenbein
Robert Bosch GmbH
DES1. Design of Cyber-physical Systems and IoT
Nirupama Bulusu
Portland State University
Pai Chou
National Tsing Hua University
Paul Kim
Dankook University
Xue Lin
Northeastern Univ.
Yung-Hsiang Lu
Purdue University
Keni Qiu
Capital Normal University
Vijay Raghunathan
Purdue University
Shao-Wen Yang
Amazon.com
DES2. SoC, Heterogeneous, and Reconfigurable Architectures
Armin Alaghi
Facebook
Scott Beamer
University of California, Santa Cruz
Nikolaos Bellas
University of Thessaly
Reetu Das
University of Michigan
Ronald Dreslinski
University of Michigan
Dimitris Gizopoulos
University of Athens
Jie Han
University of Alberta
Avinash Karanth
Ohio University
Shih-Lien Lu
Taiwan Semiconductor Manufacturing Co., Ltd.
Tony Nowatzki
UCLA Engineering
Timothy Rogers
Purdue University
Karthik Swaminathan
IBM T.J. Watson Research Center
John Wadden
University of Michigan
Jishen Zhao
University of California, San Diego
DES3. Machine Learning and Artificial Intelligence Architectures
Nitin Chandrachoodan
Indian Institute of Technology Madras
Nandhini Chandramoorthy
IBM Corporation
Jungwook Choi
IBM T.J. Watson Research Center
Ahmed Hemani
Royal Institute of Technology
Michael Huebner
Brandenburg Univ. of Technology
Jae-Joon Kim
Pohang University of Science and Technology
Huichu Liu
Intel Corporation
Peter Milder
Stony Brook University
Kolin Paul
Indian Institute of Technology Delhi
Ashish Ranjan
IBM T. J. Watson Research Center
Minsoo Rhu
Korea Advanced Institute of Science and Technology
Abhronil Sengupta
Pennsylvania State University
Jae-sun Seo
Arizona State University
Dimitrios Soudris
National Technical University of Athens
Naveen Suda
Arm, Ltd.
Swagath Venkataramani
IBM T.J. Watson Research Center
Paul Whatmough
Arm, Ltd.
Shouyi Yin
Tsinghua University
Sungjoo Yoo
Seoul National University
Jintao Zhang
IBM Corporation
Wei Zhang
Alibaba Group (US)
DES4. Emerging models of computation
Charles Augustine
Intel Corporation
Saad Bin Nasir
Qualcomm Technologies, Inc.
Koushik Chakraborty
Utah State University
Deliang Fan
University of Central Florida
Bin Gao
Tsinghua University
Rajiv Joshi
IBM T.J. Watson Research Center
Siddharth Joshi
Univ. of Notre Dame
Asif Khan
Georgia Institute of Technology
Peng Li
Texas A&M University
Alexandru Paler
Johannes Kepler University Linz
Arijit Raychowdhury
Georgia Institute of Technology
Aida Todri-Sanial
Centre National de la Recherche Scientifique
Amit Trivedi
University of Illinois at Chicago
Huaqiang Wu
Tsinghua University
Yang (Cindy) Yi
Virginia Polytechnic Institute and State University
Shimeng Yu
Georgia Institute of Technology
DES5. Digital and Analog Circuits
Chris Kim
University of Minnesota
Saibal Mukhopadhyay
Georgia Institute of Technology
Garrett Rose
University of Tennessee
Mircea Stan
University of Virginia
Bo Yuan
Rutgers University
Xuan Silvia Zhang
Washington University
DES6. Emerging Device Technologies
Mudit Bhargava
Arm, Ltd.
Meng-Fan Chang
National Tsing Hua University
Joseph Friedman
University of Texas at Dallas
Jaydeep Kulkarni
University of Texas at Austin
Daniel Morris
Facebook
Kaushik Vaidyanathan
Google, Inc.
EDA1. System-on-Chip Design Methodology
John Brunhaver
Arizona State University
Luca Carloni
Columbia University
Luigi Carro
Universidade Federal do Rio Grande do Sul
Tam Chantem
Virginia Polytechnic Institute and State University
Roberto Gioiosa
Oak Ridge National Laboratory
Yuko Hara-Azumi
Tokyo Institute of Technology
Parijat Mukherjee
Intel Corporation
Sridevan Parameswaran
University of New South Wales
Hiren Patel
University of Waterloo
Laura Pozzi
University of Lugano
EDA2. In-Package and On-Chip Communication and Networks-on-Chip
Lizhong Chen
Oregon State University
Ajay Joshi
Boston Univ.
Tushar Krishna
Georgia Institute of Technology
Mahdi Nikdast
Colorado State University
Partha Pande
Washington State University
Joshua San Miguel
University of Wisconsin, Madison
Jieming Yin
Advanced Micro Devices, Inc.
Danella Zhao
Old Dominion University
EDA3. Cross-Layer Power Analysis and Low-Power Design
Ayse Coskun
Boston University
Robert Dick
University of Michigan
Younghyun Kim
University of Wisconsin, Madison
Seda Ogrenci-Memik
Northwestern University
Arnab Raha
Intel Corporation
Sherief Reda
Brown University
Ankur Srivastava
University of Maryland, College Park
Albert Zeng
Cadence Design Systems, Inc.
EDA4. RTL/Logic Level and High-level Synthesis
Luca Amaru
Dinesh Bhatia
University of Texas at Dallas
Benjamin Carrion Schafer
University of Texas at Dallas
Abhijeet Chakraborty
Synopsys, Inc.
Sabya Das
Synopsys, Inc.
John Freeman
Intel Programmable Solutions Group
Leibo Liu
Tsinghua University
Abhijit Maji
Cadence Design Systems, Inc.
Mathias Soeken
École Polytechnique Fédérale de Lausanne
Andres Takac
Mentor, A Siemens Business
Mengying Zhao
Shandong University
EDA5. Analog Design, Simulation, Verification and Test
Georges Gielen
KU Leuven
Christoph Grimm
Technische Universitut Kaiserslautern
Jaeha Kim
Seoul National University
Scott Little
Maxim Integrated, Inc.
Markus Olbrich
Leibniz University Hannover
EDA6. Digital Design, Timing and Simulation
Duane Boning
Massachusetts Institute of Technology
Zhuo Feng
Michigan Technological Univ.
Takashi Sato
Kyoto University
Jianlei Yang
Beihang University
Pingqiang Zhou
ShanghaiTech University
Hao Zhuang
Google, Inc.
EDA7. Physical Design and Verification, Lithography and DFM
Jianli Chen
Fuzhou University
David Chinnery
Mentor, A Siemens Business
Jayita Das
Intel Corporation
Duo Ding
Samsung Austin R&D Center
Rickard Ewetz
University of Central Florida
Jhih-Rong Gao
Cadence Design Systems, Inc.
Jiang Hu
Texas A&M Univ.
Victor Kravets
IBM Research
Yih-Lang Li
National Chiao Tung University
Mark Lin
National Chung Cheng University
Wen-Hao Liu
Cadence Design Systems, Inc.
Wai Kei Mak
National Tsing Hua University
David Newmark
Advanced Micro Devices, Inc.
Weiping Shi
Texas A&M University
James Shiely
Synopsys, Inc.
Xiaoqing Xu
Arm, Ltd.
EDA8. Design Verification and Validation
Mingsong Chen
East China Normal University
Goerschwin Fey
Hamburg University of Technology
Daniel Grosse
University of Bremen
Aritra Hazra
Indian Institute of Technology Kharagpur
Khaza Anuarul Hoque
University of Missouri
Prabhat Mishra
University of Florida
Graziano Pravadelli
University of Verona
Pramod Subramanyan
University of California, Berkeley
Sara Vinco
Politecnico di Torino
Avi Ziv
IBM Research - Haifa
EDA9. Manufacturing Test and Reliability
Yu Huang
Mentor, A Siemens Business
Huawei Li
Institute of Computer Technology
Irith Pomeranz
Purdue Univ.
Srikanth Venkataraman
Intel Corporation
Qiang Xu
Chinese University of Hong Kong
ESS1. Embedded Software
Guido Araujo
University of Campinas
Nicola Bombieri
Verona University
Jeronimo Castrillon
Technische Universitaet Dresden
Henri-Pierre Charles
CEA
Dionisio De Niz
Carnegie Mellon University
William Fornaciari
Politecnico di Milano
Christian Grosser
ETH Zurich
Kim Grüttner
OFFIS
Daniel Muller-Gritschneder
Technische Universität München
Eugenio Villar
Univ. of Cantabria
ESS2. Embedded System Design Methodologies
Philip Brisk
University of California Riverside
Davide Brunelli
University of Trento
Xiang Chen
George Mason University
Anup Das
Drexel University
Ujjwal Gupta
Intel Corporation
Soonhoi Ha
Seoul National University
Sander Stuijk
Eindhoven University of Technology
ESS3. Embedded Memory, Storage and Networking
Amro Awad
University of Central Florida
Yuan-Hao Chang
Academia Sinica
Jingtong Hu
University of Pittsburgh
Yang Hu
University of Texas at Dallas
Lei Ju
Shandong University
Myoungsoo Jung
Yonsei University
Bryan Kim
Seoul National University
Chenchen Liu
Clarkson U.
Duo Liu
Chongqing University
Krishna Malladi
Samsung Semiconductor, Inc.
Preeti Ranjan Panda
Indian Institute of Technology Delhi
Liang Shi
East China Normal University
Guangyu Sun
Peking University
Ming-Chang Yang
Chinese University of Hong Kong
ESS4. Near-Memory and In-Memory Computing
Bruce Childers
Univ. of Pittsburgh
Hrishikesh Jayakumar
Qualcomm, Inc.
Lei Jiang
Indiana University
Vivek Kozhikkottu
Intel Corporation
Rangharajan Venkatesan
Nvidia Corporation
Rujia Wang
Illinois Institute of Technology
Youtao Zhang
University of Pittsburgh
ESS5 Time-Critical System Design
Sebastian Altmeyer
University of Amsterdam
Alessandro Biondi
Scuola Superiore Sant'Anna
Jian-Jia Chen
Technische University Dortmund
Nan Guan
The Hong Kong Polytechnic University
Cong Liu
University of Texas at Dallas
SEC1. Hardware Security
Lejla Batina
Radboud University Nijmegen
Swarup Bhunia
University of Florida
Elena Dubrova
KTH Royal Institute of Technology
Ryan Kastner
University of California, San Diego
Yiorgos Makris
University of Texas at Dallas
Mehran Mozaffari Kermani
University of South Florida
Debdeep Mukhopadhyay
Indian Institute of Technology Kharagpur
Jeyavijayan Rajendran
Texas A&M University
Sayak Ray
Intel Corporation
Chester Rebeiro
Indian Institute of Technology Madras
Fareena Saqib
University of North Carolina
Ioannis Savidis
Drexel University
Shreyas Sen
Purdue University
Mark Tehranipoo
University of Florida
SEC2. Embedded and Cross-Layer Security
Aydin Aysu
North Carolina State University
Rosario Cammarota
Qualcomm Research
John Chandy
University of Connecticut
Yunsi Fei
Northeastern University
Christopher Fletcher
University of Illinois at Urbana-Champaign
Ian Harris
University of California, Irvine
Arun Kanuparthi
Intel Corporation
Farinaz Koushanfar
University of California, San Diego
Kartik Mohanram
University of Pittsburgh
Tauhidur Rahman
University of Alabama
Avesta Sasun
George Mason Univ.
Michael Tunstall
Rambus Cryptography Research Division
Yanzhi Wang
Northwestern University
Wujie Wen
Florida International University
Chengmo Yang
University of Delaware
Qiaoyan Yu
University of New Hampshire
