San Jose, CALIF. –– June 6, 2016 –– The Electronic System Design (ESD) Alliance, an international association of companies providing goods and services throughout the semiconductor design ecosystem, today announced availability of the latest version of the Multi-Die integrated circuit (IC) Design Guide.
Version 2016.6 of the 300-page design guide has the latest background on multi-die integration techniques and technologies and includes information provided by vendors who offer multi-die IC design and manufacturing solutions and services. Edited by Herb Reiter of eda 2 asic, it is available as a free download from www.esd-alliance.org
“As the organization focused on serving the electronic system design ecosystem, we are taking an active role to bring together the design and manufacturing communities,” remarks Bob Smith, executive director of the ESD Alliance. “To that end, we’re working with Herb Reiter to publish the design guide and form the System Scaling Working Group within the Alliance.”
The ESD Alliance will have handouts describing multi-die IC design and contents of the comprehensive guide in its booth (#1920) at the Design Automation Conference (DAC) this week. The DAC exhibit floor will be open Monday through Wednesday from 10 a.m. until 6 p.m. at the Austin Convention Center, Austin, Texas.
About the Electronic System Design Alliance
The Electronic System Design (ESD) Alliance, an international association of companies providing goods and services throughout the semiconductor design ecosystem, is a forum to address technical, marketing, economic and legislative issues affecting the entire industry. It acts as the central voice to communicate and promote the value of the semiconductor design industry as a vital component of the global electronics industry. For more information about the ESD Alliance, visit http://www.esd-alliance.org
For more information, contact:
Public Relations for the ESD Alliance