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Design Infrastructure Alley Presentation Opportunities

DAC 2018’s Design Infrastructure Alley brings together suppliers and professionals who enable and manage the complex hardware/software infrastructure that is needed to support the design of complex chips and systems. The electronic product design ecosystem is a critical driver of the multi-trillion dollar worldwide market for electronics. Without powerful computers and automation tools that allow complex systems to be created and designed, new and innovative electronic products would never make it to market.

The Design Infrastructure Alley adds the following topic areas to the discussion at DAC 2018 in San Francisco.

• License Management

• Grid Computing

• Storage Management

• Data Security

• Design-on-Cloud

Opportunity for Presentations and Panel Discussions

The Design Infrastructure Alley features a dedicated theater for presentations and panel discussions. A limited number of 45 minute speaking slots and panel discussions are available. Exhibitors located in the Design Infrastructure Alley have highest priority for the available slots as the cost of the speaking opportunity is included with each exhibit space rental in the Design Infrastructure Alley.

Other participants are invited to apply for the remaining speaking or panel discussion slots. The organizing committee will evaluate each proposal for its relevance and contribution to the topic of Design Infrastructure. Selected proposals are subject to a $4,000 speaking fee. The organizing committee also reserves the right to solicit invited speakers to present in the theater.

Participants in any of the topic areas as listed above are invited to submit presentation or panel discussion proposals that describe experiences, best practices, innovations, limitations and future directions. Presentation proposals should be focused on furthering the discussion and exchange of ideas in the topic areas and not product-focused sales presentations.

Submission Format - Presentation proposals

Presentation proposals must contain the following information:

The title of the presentation
Topic area(s) being addressed
Abstract of 200 words or less
Presenter(s) name, affiliation, city, state, country, and email address
Accepted proposals will be allocated 30 minutes for presentation with an additional 15 minutes for audience Q&A following the presentation

The committee will make selections based on the relevance of the discussion to design infrastructure. Sales or marketing pitches for specific products or services will not be considered.

For detailed submission instructions, please click here.

Submission Format - Panel discussion proposals

Panel discussion proposals must contain the following information:

The title of the panel discussion
Topic area(s) being addressed
Abstract of 200 words or less
Proposed panel participants including moderator
Panel organizer’s name, affiliation, city, state, country, and email address
Panel discussions will be allocated 45 minutes

For detailed submission instructions, please click here.

Topic areas

Please select up to two of the following Topic Areas:

Automotive
Design
EDA
ESS
IoT
IP
Machine Learning/AI
Security/Privacy

keywords

Please select up to three of the following Keywords:

Advanced Packaging
Analog & Mixed-signal Design
Architecture & System Design
Emerging Architectures & Technologies
Interconnects
Logic & High-Level Synthesis
Low-Power & Reliability
Physical Design & DFM
Reconfigureable Systems
Test & Verification
Any

Deadlines

All presentation proposals (abstracts) must be received by March 9, 2018.

All panel discussion proposals (abstracts and participants) must be received by March 9, 2018

The organizing committee will notify the authors of approved presentation and/or panel discussion proposals by March 15, 2018.

Approved presentations and panel discussion information must be received by April 30, 2018

Guidelines for accepted presentations

All approved presentations must be received by April 30, 2018

Presentations must be submitted in PDF in 16:9 aspect ratio (slides can be created in Powerpoint, but should be saved as .pdf to submit)
Total number of slides must be 12 or fewer (including title slide)
Company logo may only appear on title slide
Intro slide should clearly state the topic being addressed
Slides should be used to frame the discussion – presenters are encouraged to minimize the amount of content on the slides and focus on providing details via discussion
Presentation should be 30 minutes maximum to allow for 15 minutes of audience Q&A after the presentation
Important - ensure that you have the necessary legal, trademark, copyright, and/or organizational approval needed to submit your presentation. Take appropriate steps to get this approval early, as the submissions deadline cannot be extended.

Guidelines for accepted panel discussions

All approved panel discussion materials and information must be received by April 30, 2018

Title of the panel discussion and abstract describing topic(s) being addressed
Final list of all panelists including name, title, affiliation, and email address
Point of view being offered by each panelist (to ensure balance and the broadest discussion)
Name, title, affiliation and email address for panel moderator
Powerpoint may be used (suggested, but not mandatory) to introduce the panel topic, panelists and moderator
Powerpoint may be used (suggested, but not mandatory; 2 slides maximum) if each panelist is to offer a point of view prior to the group discussion.
If Powerpoint slides are used they must be in 16:9 aspect ratio
Any Powerpoint slides should be submitted in .pdf format
Panel discussion including introductions is allocated 45 minutes
Important – panelist should ensure that they have any necessary legal, trademark, copyright, and/or organizational approval needed for their participation in the discussion.

timeline

Submission is Now Closed

Submission Closes - Friday, March 9, 2018
5:00PM (MST), (-7:00 GMT)

Accept/Reject Notification - March 15, 2018

Final Session Details Due - April 30, 2018

organizing committee

Derek Magill
Qualcomm
Email

Paul Cohen
ESD Alliance
Email

Bob Smith
ESD Alliance
Email

Submission Site Questions

Corinne Nichols
Events Coordinator
Email