TSMC VP of R&D to discuss industry opportunities in sub-10nm era
Louisville, Colo. –– January 16, 2014 –– Cliff Hou, PhD, will be a keynote presenter in June 2014 at the Design Automation Conference (DAC), the premier conference devoted to the design and automation of electronic systems. Dr. Hou will discuss how the introduction of 10nm and 7nm processes will alter today’s ecosystem while opening greater EDA and IP opportunities, and will present new system and chip designs. The 51st DAC will be held at the Moscone Convention Center in San Francisco, California from June 1-5, 2014.
Dr. Hou will highlight how continued chip- and wafer-based scaling will deliver the power and performance necessary to deliver wondrous new applications. A grand alliance of design ecosystem, equipment and material suppliers will result in production at 10nm and heterogeneous silicon integration that combines chips from multiple process technologies with 3D packaging to deliver compelling economics for a “System in a Si Superchip.” He will discuss the new design techniques and system and chip design challenges likely to be faced by the electronics design and supply ecosystem, outlining the need for even greater levels of collaboration and cooperation.
“Industry Opportunities in the Sub-10nm Era” will be presented at 3:00pm on Monday, June 2, 2014 at DAC.
Along with exciting keynotes, DAC 2014 will feature three new tracks focused on Automotive, Intellectual Property (IP) and Security, while keeping the tradition of offering the best-in-class solutions that promise to advance electronic design automation (EDA) and embedded systems and software (ESS).
As the primary venue for the design and automation of electronic systems, DAC offers outstanding training, education, exhibits and superb networking opportunities for designers, researchers, tool developers and vendors. For more information visit www.dac.com
About Dr. Hou
Dr. Cliff Hou was appointed in 2011 as TSMC’s Vice President of R&D. He joined TSMC in 1997. He was previously a Senior Director for Design and Technology Platform, where he established the company’s technology design kit. He also led TSMC’s in-house IP development teams from 2008 to 2010.
Before TSMC, Dr. Hou was with Taiwan’s national telecommunications laboratory, ITRI/CCL, where he workedin front-end design environment development and as a consultant specializing in physical verification methodologies. Dr. Hou served as an Associate Professor at Kaohsiung Polytechnic Institute in Taiwan.
Dr. Hou holds 20 U.S. Patents and serves as a board member of Global Unichip Corp. He received his B.S. degree in control engineering from Taiwan’s National Chiao-Tung University, and Ph.D. in electrical and computer engineering from Syracuse University.
The Design Automation Conference (DAC) is recognized as the premier event for the design of electronic circuits and systems and for electronic design automation (EDA) and silicon solutions. Since 1964, a diverse worldwide community of many thousands of professionals has attended DAC. They include system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives as well as researchers and academicians from leading universities. Close to 60 technical sessions selected by a committee of electronic design experts offer information on recent developments and trends, management practices and new products, and methodologies and technologies. A highlight of DAC is its exhibition and suite area featuring leading and emerging EDA, silicon, intellectual property (IP) automotive, security and design services providers. The conference is sponsored by the Association for Computing Machinery (ACM), the Electronic Design Automation Consortium (EDA Consortium), and the Institute of Electrical and Electronics Engineers (IEEE), and is supported by ACM's Special Interest Group on Design Automation (ACM SIGDA).
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