Electronic Design Automation (EDA) is at the foundation of modern semiconductor and electronic system innovation. As designs grow more complex, from advanced devices and chips to multi-die systems and complete electronic platforms, EDA is evolving to address challenges that span architecture, hardware, software, packaging, and multiple physical domains.

DAC has been the premier forum for advances in design automation for more than five decades. Today, the EDA program explores both the continued advancement of core design technologies and the emerging methodologies needed to develop increasingly complex systems. Topics include design and verification, physical design, modeling and simulation, system-level design, low-power and reliability, multi-die and 3D integration, heterogeneous systems, advanced packaging, and system technology co-optimization.

EDA is also entering a new era as AI, generative AI, and agentic approaches become integrated into engineering workflows. These technologies are creating new opportunities to automate complex tasks, accelerate design-space exploration, improve engineering productivity, and enable increasingly autonomous design processes.

At the same time, electronic design is becoming more multi-domain. Electrical, thermal, mechanical, electromagnetic, and other physical effects must increasingly be considered together, driving new approaches to multi-physics analysis, data management, interoperability, and optimization across the design lifecycle.

DAC's EDA program brings together researchers, engineers, tool developers, and technology leaders to present advances in design automation, methodologies, tools, and real-world practices that will enable the next generation of chips and electronic systems.

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