The most advanced electronic products are no longer defined by a single chip, technology, or discipline. Systems Design brings together hardware, software, architectures, networks, packaging, and physical technologies to create complete systems optimized for performance, power, efficiency, reliability, security, safety, and cost.
As computing expands from intelligent edge devices to autonomous platforms and hyperscale data centers, system requirements increasingly drive decisions throughout the design process. Workloads particularly those associated with AI and accelerated computing are influencing processor and accelerator architectures, memory and interconnect, chiplet and multi-die integration, advanced packaging, power delivery, cooling, and software.
DAC's Systems program explores the methodologies and technologies required to design and optimize these increasingly complex platforms. Topics include hardware/software co-design, system architecture and modeling, workload-driven design, heterogeneous and multi-die systems, embedded and real-time systems, AI and accelerated computing platforms, data-center and edge systems, and system-level power, performance, reliability, safety, and security.
Systems Design is also becoming increasingly cross-domain. Electrical, thermal, mechanical, electromagnetic, software, and other considerations must be evaluated together, requiring greater collaboration across engineering disciplines and new approaches to modeling, simulation, optimization, and system-level verification.
DAC brings together researchers, system architects, hardware and software engineers, and technology developers to exchange ideas, share real-world experience, and explore the innovations needed to build the next generation of intelligent, efficient, and highly integrated electronic systems.