The DAC Front-End Design Track is one of the DAC Engineering Tracks and the premier forum the community of design engineers use to get together and share their challenges and their approaches to solving them.
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The Front-End Design Track includes presentations and posters to facilitate information sharing and interactions. It offers an exclusive opportunity to connect with and learn from other industry experts about best practices and current trends in front-end design and verification. There is no better way to improve your "design IQ" in a short amount of time.
The Front-End Design Track committee is looking for submissions that tackle relevant topics and provide high-quality content which target challenges, innovations, and trends in chip design focusing on Front-End Design defined as getting to verified RTL and verified behavioral descriptions, including IC architecture, design, simulation, validation and verification solutions for Systems on Chips (SoCs) and chiplet-based multi-die designs. Use of cloud (public or private) for improving quality of results in front-end topics is of interest.
For each accepted submission, a presenter is required to register for DAC at either the Engineering or Full Conference registration rates; presentation is contingent on registering by April 10, 2027.
Submission Information
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The following are required for your submission:
The title of the presentation
Abstract of 100-200 words
Submission Categories
Presenter(s) name, affiliation, city, state, country, and email address
For evaluation by the Program Committee, a six (6) slides* PowerPoint presentation. Please review the guidelines below for suggested presentation structure.
*Additional information may be added in the notes section for each slide.
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The following guidelines should be followed when preparing your slides for submission:
Submissions are limited to 6 total slides*.
PowerPoint Template (Coming Soon!)
Submissions must be in PowerPoint format: 16:9 aspect ratio.
Consistent with DAC policy, company logos may appear only on the title slide.
Slide 1: Title, author names and affiliations
Authors may NOT be added after acceptance, so be sure to list all authors in the initial submission.
Slide 2: Motivation
Include an introduction that specifies the context and motivation of the submission. Examples: identify challenges associated with the design task at hand, clarify where in the design process the tools are used, and explain why the problem addressed is of interest to the audience.
Slide 3: Main Idea
Include details on the specific contributions of your work. Examples: innovative use of tools to achieve a specific goal, user enhancements to the tool and/or tool flow, dealing with scalability, details of integrating IP, study of design trade-offs, interfacing with manufacturing.
Slide 4: Additional Content Slide
Flexibility to add a slide that demonstrates value of the paper/idea
Slide 5: Evidence
Slide 6: Summary
Include a summary that highlights the main results of your work. Results are needed to evaluate the impact of your contribution. Metrics that could be used include productivity enhancement, improved quality of silicon, decreased complexity, and reduced time-to-market.
Important: Ensure that you have the necessary legal, trademark, copyright, and/or organizational approval needed to submit your presentation. Take appropriate steps to get this approval early, as the submissions deadline cannot be extended.
*Note: The presentation format described above is what is required for your submission to be reviewed by the Technical Program committee to decide Accept/Reject. The final presentation delivered at DAC will be made up of a Title slide, Author slide and 12 content slides. The expectation is that the final presentation will expand on the submission presentation.
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Documented tool use may target electronic design and system design at all levels of abstraction and across all application domains. Regular submissions will be accepted in the following categories:
Front-End Silicon Design (FE)
Front end architecture, design and verification of current day System-on-Chip (SoC) including major components such as CPU, GPU, and DSP. Front end design of entire SoC sub-systems such as graphics, multimedia and modem.
FE.01 Architecture Exploration/Design/Optimization of CPU, GPU, DSP, Modem, and Accelerators, System and High-Level Hardware Synthesis
FE.07 Logic/RTL Synthesis
FE.02 Memory/Bus/Network Architecture/Design
FE.08 Security: Modeling, Analysis and Synthesis, Security Threats and Metrics, Device, Circuit and Architecture Techniques for Security, Hardware Security Verification and Validation, System-Level Techniques for Security and Hardware Support for Software and Security
FE.03 Low-Power Design and Trade-offs
FE.09 Machine Learning Techniques for Verification, Logic/RTL Synthesis
FE.04 Design Verification, Test Planning, and Coverage
FE.10 Chip Architectures and Designs Targeting ML/AI Applications, System Design Targeting ML/AI Applications
FE.05 Validation, Logic Simulation, Emulation, Hardware Acceleration, FPGAs
FE.11 Cloud Adoption in Design and Verification Flows, Case Studies in Cloud Migration and Cloud Infrastructure for EDA Applications
FE.06 Formal Verification, Linting
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Engineering Track submissions are typically accepted for one of the following categories:
Presentation: a 15-minute slot during an engineering session, combined with a poster
Poster gladiator: a 7-minute slot during a poster gladiator event on the exhibition floor, combined with a poster
Poster: a slot during the one hour poster session on one of the conference days
Accepted Front End Design Track presentations and posters are NOT included in the DAC proceedings. However, accepted Front-End Design Track submissions (both posters and presentation slides) will be made available on the DAC website after the conference as a part of the DAC Archives (subject to approval from the authors).
Best Presentation awards will be awarded based on (a) the quality of the submission, (b) the pre-recorded presentation video, and (c) the presentation given at DAC.
Timeline
Submission Selections
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Please select up to two of the following Topic Areas:
Artificial Intelligence (AI)
Security
Design
Systems
Electronic Design Automation
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Please select up to three of the following Keywords:
AI and Machine Learning
Formal/Static Methods
Analog & Mixed-signal Design
Low Power
Architecture & System Design
Logic & High-level Synthesis
Chiplets, Interconnects and 3D Integration
Manufacturing and Process
Circuits and Technology
Physical Design
Cloud Computing, Compute/Storage Infrastructure
Quantum Computing
Design Technology Co-optimization
Safety & Reliability
Embedded Systems and IoT
Security & Privacy
Emerging Technologies
Test and Design for Test (DFT)
FPGA Systems
Verification & Validation
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If a submission will be relevant to a specific industry or industries, one or more of the following industries may be selected:
Aerospace and Defense
Industrial
Automotive
Wireless Communications
Consumer
Wired Communications
Data Center