DAC 2017 | DAC Pavilion Videos
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Cadence’s CEO shares insights about big changes in the data center and end markets, the rise of machine learning, growing challenges in system design, and what to watch for in China, in a lively discussion with Semiconductor Engineering Editor In Chief Ed Sperling.
Speaker:
Lip-Bu Tan - Cadence Design Systems, Inc., San Jose, CA
Moderator:
Ed Sperling - Semiconductor Engineering, San Jose, CA
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When China announced its national plan to promote its native IC industry, this raised many questions. With its rapid growth, China's IC industry is becoming an emerging force globally, increasing the importance of understanding the answers to these questions. Few people really understand China's IC industry. For example, what is the real state of the China's IC industry today, what implications does such a promotion have to the global IC, EDA and other related industries, and what goals are China's IC industry working to achieve?
This presentation will give an overview of the Chinese IC market, followed by an introduction of China's IC industry with an emphasis on fabless companies. China’s native products, design technologies, and talents will be described in detail to provide an objective and comprehensive picture of China's IC industry. In addition, China's current status in design automation technology and indigenous EDA companies will be discussed.
As China is a unique country with huge population, vast territory, rapidly growing but unbalanced economy, and many diverse cultures, life-styles and traditions, its native product demands are also diverse. How to meet these drastically different requirements with a reasonable time to market while keeping costs low presents a big challenge. A rapidly growing IC industry in China will force design and EDA engineers, both inside and outside China, to explore, to innovate as well as to collaborate. With a large talent pool addressing unique challenges, who can say there will not be new technologies, methodologies and products emerging to change the rules of the global information technology landscape?
Speaker:
Shaojun Wei - Tsinghua Univ., Beijing, China
Organizer:
Sharon Hu - Univ. of Notre Dame, IN
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The moment you've all been waiting for: Nintendo has finally released a brand new Zelda game! And, incidentally, a new console to play it on—the Switch. Join iFixit, the world's foremost experts on teardowns and repair, for a legendary adventure through the depths of this handheld/console hybrid. They'll tear through the system to expose the tech and rate its repairability.
Speakers:
Evan Noronha - iFixit, San Luis Obispo, CA
Scott Havard - iFixit, San Luis Obispo, CA
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This panel will honor the five recipients of DAC’s New Under 40 Innovator Award Winners. Panelists will discuss where they see the future of electronic design, the current trends and new markets that may or may not be a factor in the next decade. Winners will be announced Monday, June 19 at the General Session.
Moderator:
Dylan McGrath - EE Times, San Francisco, CA
Panelists:
Sasikanth Manipatruni - Intel Corp., Hillsboro, OR
John Arthur - IBM Research - Almaden, CA
Douglas Densmore - Boston Univ., Boston, MA
Yongpan Liu - Tsinghua Univ., Beijing, China
Paul Cunningham - Cadence Design Systems, Inc., Santa Clara, CA
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Synopsys' chairman and co-CEO talks with Semiconductor Engineering Editor In Chief Ed Sperling about the rise of "smart" everything—the third generation of electronics. What are the drivers, the important trends, and the future possibilities for the silicon-to-software ecosystem.
Moderator:
Ed Sperling - Semiconductor Engineering, San Jose, CA
Speaker:
Aart de Geus - Synopsys, Inc., Mountain View, CA
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Today lots of companies are building systems that gather data and automatically process this to drive parts of their business operations. Obvious cases are Amazon telling you at point of sale, "Other people who bought XYZ shoes purchased ABC socks and ZXY shoe polish". We are move deeper into this new world at a blinding pace. Listen to Jim discuss with industry experts what can be done in this area, what we should be worried about, and where it is all going.
Moderator:
Jim Hogan - Vista Ventures, Los Gatos, CA
Panelists:
James Gambale - Lomasoft Corp., San Diego, CA
Chris Rowen - Cognite Ventures, Santa Cruz, CA
Raik Brinkmann - OneSpin Solutions GmbH, San Jose, CA
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DAC attendees are invited to join industry luminaries Simon Segars and Lucio Lanza in a lively, far-reaching conversation about the Internet of Things, and how the digital world will be connected with the physical world. Expect an analysis of the variety of new components required –– far more than the industry is accustomed to –– to support the emerging analog/mixed-signal phenomenon. They will consider how to meet these challenges, why the design ecosystem needs to be reinvented as well as why design and device costs must be reduced to meet a reasonable target. Attendees can expect to hear about new compute models and architectures, smaller processors and how an IoT infrastructure can be secured. The conversation will conclude with a few intriguing predictions on the biggest trends, along with the dreams of how to shape the IoT wave.
Moderator:
Ed Sperling - Semiconductor Engineering, San Jose, CA
Speakers:
Simon Segars - ARM Ltd., Cambridge, United Kingdom
Lucio Lanza - Lanza TechVentures, Palo Alto, CA
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Last year GoPro’s airborne camera division took flight. Unfortunately, the takeoff was rather turbulent as the Karma Drone had a tendency to fall out of the sky. So, they took it back to the drawing board and re-released the Karma Drone in February. Come hang out with iFixit Teardown Extraordinaires as they rip this revamped drone apart to assess if pilots can expect smooth sailing, and how easy it will be to fix the damaged craft after you “didn’t see that tree.”
Speakers:
Scott Havard - iFixit, San Luis Obispo, CA
Evan Noronha - iFixit, San Luis Obispo, CA
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Is all the differentiation gone in hardware product design? Not too long ago, product engineers chose the components they needed to design a functional system – CPUs, cache and working memory, non-volatile memory and storage, system interconnect, offload accelerators, peripheral interfaces, and sensors. Modern System-on-Chip (SoC) designs integrate most of those design choices, while new packaging techniques integrate best of class manufacturing process choices for logic, memory, human interface (tactile, audio, and visual), communications (wired and wireless), and sensors. Unless you can fund your own chip design, it is by far cheaper to select off-the-shelf SoCs pre-packaged for specific application classes in multi-chip modules. The question then becomes – how do you differentiate your IoT widget? What’s left for product designers other than choosing the right integration level at the right price point, size, and power consumption? Seriously? Your product is now part of a service, it’s a key piece of the behavior of systems-of-systems, but so are security architecture, network architecture, data ingress and storage, analytics, and machine learning. This presentation will discuss the impacts of SoC and systems-of-systems architecture on product design and differentiation.
Speaker: Paul Teich - TIRIAS Research, Austin, TX
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Apple has finally delivered their first water-resistant iPhone, but with more ingress protection comes less… headphone jack? There's only one way to find out what's filling the void where analog output once reigned supreme. Join iFixit as they tear down the iPhone and try to answer exactly what all the “courage” is that Apple’s been talking about.
Speakers:
Scott Havard - iFixit, San Luis Obispo, CA
Evan Noronha - iFixit, San Luis Obispo, CA
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Wally Rhines, CEO of Siemens' Mentor Graphics business unit, talks with Semiconductor Engineering Editor In Chief Ed Sperling about major changes in design and EDA, including the fallout from semiconductor mergers, growth of electronic system design, and the IoT and IIoT.
Moderator:
Ed Sperling - Semiconductor Engineering, San Jose, CA
Speaker:
Wally Rhines - Mentor, A Siemens Business, Wilsonville, OR
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Electronic systems have become an indispensible part of our daily lives. All electronics devices have to convert AC (alternating current) that is available from the wall sockets into DC (direct current) to run the integrated circuits that define their functionality. This conversion is typically done by a switch mode power supply (SMPS) that was a major breakthrough in the 1980s, and has lead to the proliferation of electronics systems.
At the heart of an SMPS is a high voltage silicon power transistor. Unfortunately, silicon is not the best semiconductor for high voltage (HV) devices. Silicon based Super Junction (SJ) MOSFETs achieve up to 600V. Higher voltages in silicon are realized with Insulated Gate Bipolar Transistors (IGBTs). IGBT’s switching frequency tops off at 20kHz while HV SJ MOSFETs top off at 200kHz. Switching frequency freezes the efficiency and size of any SMPS.
III-V compound semiconductors such silicon carbide (SiC) or Gallium Nitride (GaN) are much better suited for high voltage power transistors. NexGen Power Systems has demonstrated vertical GaN Junction Field Effect Transistor (JFETs). We have demonstrated vertical JFETs operating at 1200V, passing the JDEC device reliability requirements, and switching at 1MHz. These devices have extremely low Coss and Qrr. We have also demonstrated working converter systems with vertical GaN devices. Further, we have shown the breakdown voltages for these vertical devices can scale up to 4000V and they can sink up to 400A of current.
This talk will compare the NexGen Power Systems vertical GaN devices with other devices in the market and show their impact on power applications such data centers, motor drives and photovoltaic inverters.
Speaker:
Dinesh Ramanathan - NexGen Power Systems, Inc., Cupertino, CA
Organizer:
Michael 'Mac' McNamara - Adapt-IP, Palo Alto, CA