First San Jose edition invites research breakthroughs, engineering insights and new perspectives from across the global design community

SAN JOSE, CA – October 6, 2026 – DAC, The Chips to Systems Conference, today announced that its 2027 Call for Contributions is open, inviting researchers and industry practitioners to address the technologies and design challenges reshaping electronics. Taking place July 11–14, 2027 at the San Jose Convention Center, DAC’s first San Jose gathering will bring the international chip and system design community together in the heart of Silicon Valley.

AI is changing both what engineers design and how they design it. From the computing demands of AI applications to the emergence of agentic AI in design workflows, these shifts are creating new questions about performance, power, verification, security and system integration. DAC 2027 invites contributions that examine these challenges, present new approaches and share lessons from putting them into practice.

The 2027 program spans AI, Design, EDA, Security and Systems, with opportunities to contribute original research, engineering presentations, panels, special sessions, workshops and tutorials, as well as DAC Pavilion and Exhibitor Forum sessions. Together, these formats connect research advances with the practical experience of teams developing chips, tools and electronic systems.

San Jose provides a setting where the global DAC community can exchange ideas with the semiconductor, software and systems companies concentrated in Silicon Valley. DAC welcomes contributions from established experts, emerging researchers and engineers bringing new perspectives to the field, with participation opportunities extending from individual technical presentations to proposals for broader discussions and educational sessions.

DAC 2027 is led by General Chair David Z. Pan of The University of Texas at Austin and DeepWeave, and Vice Chair Natarajan (Nat) Viswanathan of Cadence Design Systems. Technical Program Chair Ambar Sarkar of NVIDIA is joined by Technical Program Co-Chairs Rajiv Joshi of IBM and Jiang Hu of Texas A&M University.

Contributors can select the format that best fits their research, design experience or proposed discussion. Submission opportunities include:

For submission instructions, categories and deadlines, visit the DAC 2027 Call for Contributions.

About DAC

DAC, The Chips to Systems Conference is recognized as the premier event for the design of electronic circuits and systems and for electronic design automation (EDA) and silicon solutions. A diverse worldwide community representing more than 1,000 organizations attends each year, represented by system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities. Close to 400 technical sessions selected by a committee of electronic design experts offer information on recent developments and trends, management practices and new products, methodologies and technologies. A highlight of DAC is its exhibition and suite area with approximately 150 of the leading and emerging EDA, intellectual property (IP) design infrastructure and electronic design ecosystem providers. The conference is sponsored by the Association for Computing Machinery (ACM) and the Institute of Electrical and Electronics Engineers (IEEE) and is supported by ACM's Special Interest Group on Design Automation (ACM SIGDA) and IEEE's Council on Electronic Design Automation (IEEE CEDA).

DAC acknowledges trademarks or registered trademarks of other organizations for their respective products and services.

# # #

For more information, please contact:

Michelle Clancy Fuller, Cayenne Global, LLC

2027 DAC Publicity/Marketing Chair

Press@dac.com or call 1-503-702-4732