SAN JOSE, CA –– September 21, 2026 ––DAC, The Chips to Systems Conference (DAC) the global event dedicated to electronic design and design automation of electronic circuits and systems, is pleased to announce its executive committee for the upcoming DAC 2027 to be held at the San Jose Convention Center, San Jose, CA.

Dr. David Z. Pan, Silicon Laboratories Endowed Chair Professor of Department of Electrical & Computer Engineering at The University of Texas at Austin, and Co-Founder/CTO of DeepWeave, will serve as the General Chair for the 2027 conference. Joining him as Vice Chair is Natarajan Viswanathan, Software Engineering Group Director, Cadence Design Systems. Together, they will lead the DAC Executive Committee (EC), in guiding the technical program, exhibition, and strategic initiatives while shaping all aspects of conference operations and publicity.

DAC 2027 will take place at the San Jose Convention Center, San Jose, California, from July 11–14, 2027. The call for contributions opens October 1, 2026, with full details available at DAC.com.

“DAC is at an exciting point in its evolution as AI transforms not only how we design chips and systems, but also who is participating in the design ecosystem,” said Dr. Pan. “As General Chair for DAC 2027, I look forward to building on DAC’s strong technical foundation while embracing new ideas, new companies and a new generation of designers and researchers. Our goal is to ensure DAC continues to be the place where the community comes together to explore what’s next and help shape the future of semiconductor and system design.”

The distinguished members of the 2027 DAC Executive Committee joining Dr. Pan include:

Vice Chair – Natarajan Viswanathan, Cadence Design Systems
Technical Program Chair – Ambar Sarkar, Nvidia
Technical Program Co-Chair – Jiang Hu, Texas A&M University
Technical Program Co-Chair – Rajiv Joshi, IBM
Panels Chair – Frank Schirrmeister, Synopsys
Special Sessions Chair – Farinaz Koushanfar, University California, San Diego
Tutorials/Workshops Chair – Wei Zhang, The Hong Kong University of Science and Tech.
Engineering Track Program Chair – Henning Spruth, NXP
Engineering Track Program Vice-Chair – Nanditha Rao, IBM
New Initiatives & Awards Chair – Sung Kyu Lim, USC
Special Programs Chair – Jake Wiltgen, Siemens
Exhibits Chair – Richard Paw, Microsoft
Finance Chair – Frank Liu, Old Dominion University
Senior Advisor – Patrick Groeneveld, AMD and Stanford University
Publicity/Marketing Chair – Michelle Clancy Fuller, Cayenne Global
Past Chair – Renu Mehra, Synopsys
ACM SIGDA Representative – Sharon Hu, University of Notre Dame
ACM SIGDA Representative – Christian Pilato, Politecnico di Milano
IEEE CEDA Representative – Cristiana Bolchini, Politecnico di Milano
IEEE CEDA Representative – L. Miguel Silveira, INOV Lab/INESC-ID/IST Techo/University Lisbon
Conference Management – Laura LeBlanc, Conference Catalyst
Exhibit Manager – Pete Erickson, Hall-Erickson

Dr. Pan received his B.S. from Peking University and M.S. and Ph.D. degrees from the University of California, Los Angeles (UCLA). Before joining academia, he was a Research Staff Member at the IBM T. J. Watson Research Center. His research spans electronic design automation (EDA) for digital, analog, radio frequency integrated circuits and emerging technologies, synergistic AI/IC co-optimizations, and design/system and technology co-optimizations. He has published more than 550 technical papers, holds 10 U.S. patents and has advised several startups as well as Google X and DeepMind. He has also served as a visiting professor at MIT and has graduated more than 60 Ph.D. and postdoctoral researchers at UT Austin.

A Fellow of ACM, IEEE and SPIE, he has held leadership roles across many of the semiconductor design community’s major conferences, including General Chair of ICCAD 2019, and ISPD 2008, Program Chair of ASPDAC 2017, ICCAD 2018, and DAC 2024. He served in the ACM/SIGDA Executive Committee as the Award Chair from 2018 to 2021. His numerous honors include the SRC Technical Excellence Award, ACM/SIGDA Outstanding New Faculty Award, NSF CAREER Award, UCLA Engineering Professional Achievement in Academia Award, multiple IBM Faculty Awards, the inaugural NVIDIA Research Faculty Fellowship, Cadence Academic Collaboration Award, MediaTek Academia-Industry Collaboration Excellent Research Award, DAC Top 10 Author in Fifth Decade, and more than 20 Best Paper Awards.

About DAC

DAC, The Chips to Systems Conference is recognized as the premier event for the design of electronic circuits and systems, and for electronic design automation (EDA) and silicon solutions. A diverse worldwide community representing more than 1,000 organizations attends each year, represented by system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities. Close to 120 technical sessions selected by a committee of electronic design experts offer information on recent developments and trends, management practices and new products, methodologies, and technologies. A highlight of DAC is its exhibition and suite area with approximately 150 of the leading and emerging EDA, intellectual property (IP) design infrastructure and electronic design ecosystem providers. The conference is sponsored by the Association for Computing Machinery (ACM) and the Institute of Electrical and Electronics Engineers (IEEE) and is supported by ACM's Special Interest Group on Design Automation (ACM SIGDA) and IEEE's Council on Electronic Design Automation (IEEE CEDA).

DAC, The Chips to Systems Conference acknowledges trademarks or registered trademarks of other organizations for their respective products and services.

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For more information:

Michelle Clancy Fuller, Cayenne Global

2027 DAC Publicity/Marketing Chair

+1-503-702-4732